The entire production process of FPC flexible circuit board

The entire production process of FPC flexible circuit board

FPC, namely flexible circuit board and flexible board, is characterized by high wiring density, light weight, thin thickness and good bending performance. At present, China has become the world's main production base for FPC flexible circuit boards.

The process is roughly as follows:

Material cutting - drilling - black hole - VCP - cleaning - film application - exposure - DES - AOI - cleaning - bonding - pressing - target punching - gold plating - screen printing - electrical testing - assembly - appearance/knife mold - FQC - FQA - SMT - packaging - warehousing - shipment

Main downstream application areas of FPC:

Including mobile phones, computers, LCD displays, digital cameras, automotive electronics, medical electronics, as well as consumer digital products such as hard drives, mobile storage, printers, etc.

FPC's main downstream customers:

International large electronic product manufacturers such as Apple, Samsung, Sony, Toshiba, IBM, Dell, HP, Philips, LG, Huawei, ZTE, Lenovo, etc.